Grinding and Polishing Machine - List of Manufacturers, Suppliers, Companies and Products

Grinding and Polishing Machine Product List

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Automatic Programming NC Centering Grinding and Polishing Device

Even beginners in lens processing can feel at ease. No mistakes with automatic initial settings.

The "Automatic Programming NC Centering Grinding and Polishing Device" is a polishing machine that can automatically set processing conditions just by inputting lens information. It features a lineup including the cup wheel smoothing machine "QCN-CS type," the smoothing machine "QCN-S type," and the polishing machine "QCN-P type." Additionally, it allows for customization tailored to specific purposes by combining the "base device" and "processing modes." 【Features】 ■ High precision and high reproducibility ■ Initial setting automatic programming function ■ Standardization of lens processing = completion of skill-less operation ■ Conditions can be changed according to preferences ■ Processing conditions are automatically set just by inputting lens information *For more details, please refer to the PDF document or feel free to contact us.

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Fully Automatic Wafer Grinding and Polishing Equipment 'CMG-802XJ'

It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!

The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that arranges four vacuum chucks on a indexing table and processes in sequence through chuck surface cleaning, rough grinding, finishing grinding, and polishing using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands of various IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it can provide a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.

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